SCOPUS 정보 검색 플랫폼

Volumn 372, Issue 1-2, 2004, Pages 290-295

Effect of transient liquid-phase bonding variables on the properties of a micro-duplex stainless steel

Author keywords

Diffusion bonding; Dual phases; Phase transformation; Stainless steels; TLP bonding

Indexed keywords

CHEMICAL BONDS; COPPER; CORROSION RESISTANCE; GRAIN GROWTH; ISOTHERMS; METALLOGRAPHY; MICROSTRUCTURE; SOLIDIFICATION; TERNARY SYSTEMS;

MICRO-DUPLEX STAINLESS STEELS; TRANSIENT LIQUID-PHASE BONDING;

STAINLESS STEEL;

EID: 1942434545 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2004.01.023 Document Type: Article

Times cited : (43)

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