Transient liquid phase bonding process using liquid phase sintered alloy as an interlayer material

Journal of Materials Science

Volumn 35, Issue 8, 2000, Pages 1917-1924

  Kwon, Y S ^a   Kim, J S ^a   Moon, J S ^a   Suk, M J ^b  

^a University of Ulsan   (South Korea)

^b Samcheok National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACES (MATERIALS); IRON; IRON ALLOYS; PARTICLES (PARTICULATE MATTER); SOLIDIFICATION;

LIQUID PHASE SINTERED ALLOYS; TRANSIENT LIQUID PHASE (TLP) BONDING;

BONDING;

EID: 0033886737     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004762318057     Document Type: Article

References (12)

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