Characterisation and Optimisation of Innovative Solders for Transient Liquid Phase Bonding and Active Soldering

Advanced Engineering Materials

Volumn 6, Issue 3, 2004, Pages 160-163

  Lugscheider, Erich ^a   Ferrara, Stefania ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; CORROSIVE EFFECTS; DIFFUSION; ENERGY DISPERSIVE SPECTROSCOPY; INTERMETALLICS; ISOTHERMS; JOINTS (STRUCTURAL COMPONENTS); OPTIMIZATION; SCANNING ELECTRON MICROSCOPY; SOLDERING; SOLIDIFICATION; TENSILE STRENGTH; THERMAL STRESS;

ISOTHERMAL SOLIDIFICATION; MECHANICAL INTERLOCKING; MICROSYSTEM TECHNOLOGY; TRANSIENT LIQUID PHASE (TLP) BONDING;

SOLDERING ALLOYS;

EID: 2142661710     PISSN: 14381656     EISSN: None     Source Type: Journal    
DOI: 10.1002/adem.200300538     Document Type: Article

References (7)

1. E. Lugscheider, M. Aulerich, DVS-Berichte 1998, 192, 265.
2. E. Lugscheider, M. Möller, M. Aulerich, M. Lake, Tagungsbcmd Werkstoffwoche 1998, 1, 309.
3. E. Lugscheider, M. Aulerich, R. Sicking, Schweißen und Schneiden 1999, 204, 129.
4. E. Lugscheider, M. Aulerich, DVS-Berichte 2001, 212, 269.
5. E. Lugscheider, M. Aulerich, 20th Heat Treating Society Conference, St Louis, USA, October 9-12, 2000.
6. E. Lugscheider, H. Janssen, Schweißen und Schneiden 2001, 53, 207.
7. E. Lugscheider, B. Wildpanner, Joining 2002, München, Germany, 30 September-1 October 2002.