Transient liquid phase bonding of intermetallic compounds

Materials Science Forum

Volumn 426-432, Issue 3, 2003, Pages 1891-1896

  Gale, W F ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

Joining; Mechanical properties; Microstructure; NiAl; Structural intermetallic compounds; TiAl; Transient liquid phase bonding; Wettability

Indexed keywords

BONDING; METALLOGRAPHIC MICROSTRUCTURE; SHAPE MEMORY EFFECT; WETTING;

TRANSIENT LIQUID PHASE (TLP);

INTERMETALLICS;

EID: 0038001132     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.426-432.1891     Document Type: Conference Paper

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