Use of sputter coatings to control parent metal dissolution during transient liquid phase bonding

Materials Science and Technology

Volumn 12, Issue 7, 1996, Pages 603-606

  Khan, T I ^a   Wallach, E R ^b  

^a BRUNEL UNIVERSITY   (United Kingdom)

^b UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0013248232     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/mst.1996.12.7.603     Document Type: Article

References (5)

1. Y. NAKAO, K. NISHIMOTO, K SHINOZAKI, and C. KANG: in 'Joining of advanced materials', 157-172; 1990, London, Chapman and Hall.
2. I TAUH-POKHU, M. DOLLAR, and T. B. MASSALSKI: Metall. Trans. A, 1988, 19A, 675-686.
3. 'Good-fellow catalogue', The Science Park, Cambridge, 1989.
4. T. I. KHAN and E. R WALLACH: in Proc. 3rd Int. Conf. on 'Trends in welding research', Gathnburg, TN., USA, June 1992, American Welding Society, 1095-1099.
5. E. A. BRANDES: 'Smithells metals reference book', 6th edn, 11-97; 1983, London, Butterworths.