Numerical Modeling of the Transient Liquid-phase Diffusion Bonding Process of Al Using Cu Filler Metal

ISIJ International

Volumn 43, Issue 12, 2003, Pages 1976-1982

  Natsume, Yukinobu ^a   Ohsasa, Kenichi ^a   Tayu, Yoshinori ^b   Momono, Tadashi ^b   Narita, Toshio ^a  

^a HOKKAIDO UNIVERSITY   (Japan)

^b MURORAN INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Aluminum; Copper; Diffusion controlled model; Isothermal solidification; Simulation; Transient liquid phase diffusion bonding; Volume change

Indexed keywords

ALUMINUM; BONDING; COMPUTER SIMULATION; COOLING; COPPER; DIFFUSION IN LIQUIDS; MATHEMATICAL MODELS; MELTING; MICROSTRUCTURE; SOLIDIFICATION; SURFACE TENSION; THERMAL EFFECTS;

DIFFUSION-CONTROLLED MODEL; ISOTHERMAL SOLIDIFICATION; TRANSIENT LIQUID-PHASE DIFFUSION BONDING; VOLUME CHANGE;

FILLER METALS;

EID: 1242352419     PISSN: 09151559     EISSN: None     Source Type: Journal    
DOI: 10.2355/isijinternational.43.1976     Document Type: Article

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