Critical interlayer thickness for transient liquid phase bonding in the Cu-Sn system

Acta Materialia

Volumn 52, Issue 10, 2004, Pages 2965-2972

  Bosco, N S ^a   Zok, F W ^a  

^a University of California   (United States)

Author keywords

Copper; Electron beam methods; Intermetallic compounds; Transient liquid phase bonding

Indexed keywords

BONDING; COPPER; ELECTRONIC EQUIPMENT; INTERFACES (MATERIALS); INTERMETALLICS; METALLIZING; SOLIDIFICATION; SOLUBILITY; TIN;

BOND STRUCTURES; ELECTRON BEAM METHODS; ISOTHERMAL SOLIDIFICATION; TRANSIENT LIQUID PHASE BONDING;

MATERIALS SCIENCE;

EID: 2642517182     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2004.02.043     Document Type: Article

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