Transient-liquid-phase and liquid-film-assisted joining of ceramics

Journal of the European Ceramic Society

Volumn 26, Issue 4-5, 2006, Pages 363-372

  Sugar, Joshua D ^a,b   McKeown, Joseph T ^a,b   Akashi, Takaya ^a,b   Hong, Sung M ^a,b   Nakashima, Kunihiko ^c   Glaeser, Andreas M ^a,b  

^a University of California Berkeley   (United States)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^c KYUSHU UNIVERSITY   (Japan)

Author keywords

Al2O3; Fracture; Interfaces; Joining; Strength

Indexed keywords

ALUMINA; BONDING; FRACTURE TOUGHNESS; INTERDIFFUSION (SOLIDS); INTERFACES (MATERIALS); JOINING; LIQUID METALS; LIQUIDS; METALLIC FILMS; MULTILAYERS;

LIQUID-FILM-ASSISTED JOINING (LEAJ); MULTILAYER METALLIC INTERLAYERS; THIN LIQUID FILMS; TRANSIENT-LIQUID-PHASE (TLP) JOINING;

CERMETS;

CERAMICS;

EID: 29944446072     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jeurceramsoc.2005.06.034     Document Type: Article

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