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Volumn 29, Issue 1, 1998, Pages 315-325

Isothermal solidification kinetics of diffusion brazing

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DIFFUSION IN SOLIDS; MATHEMATICAL MODELS; PHASE INTERFACES; SILVER; SOLIDIFICATION;

EID: 0031649614     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-998-0183-1     Document Type: Article
Times cited : (84)

References (21)
  • 1
    • 0342553675 scopus 로고
    • Proc. TMS Symp. on The Materials Science of Joining, TMS, Warrendale, PA
    • W.D. MacDonald and T.W. Eagar: Transient Liquid Phase Bonding Process, Proc. TMS Symp. on The Materials Science of Joining, TMS, Warrendale, PA, 1991, pp. 93-100.
    • (1991) Transient Liquid Phase Bonding Process , pp. 93-100
    • MacDonald, W.D.1    Eagar, T.W.2
  • 17
    • 0004020231 scopus 로고
    • The Clarendon Press, Oxford, United Kingdom
    • J. Crank: The Mathematics of Diffusion, The Clarendon Press, Oxford, United Kingdom, 1956, p. 13.
    • (1956) The Mathematics of Diffusion , pp. 13
    • Crank, J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.