Transient liquid-phase bonding in two-phase ternary systems

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 31, Issue 4, 2000, Pages 1187-1192

  Sinclair, C W ^a   Purdy, G R ^b   Morral, J E ^a  

^a MCMASTER UNIVERSITY   (Canada)

^b UNIVERSITY OF CONNECTICUT   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; SOLIDIFICATION; SOLUBILITY;

TRANSIENT LIQUID-PHASE (TLP) BONDING;

TERNARY SYSTEMS;

EID: 0033742758     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-000-0114-2     Document Type: Article

References (9)

1. W.D. MacDonald and T.W. Eagar: in The Metal Science of Joining, M.J. Cieslak, ed., TMS, Warrendale, PA, 1992, pp. 93-100.
2. C.W. Sinclair: J. Phase Equilibria, 1999, vol. 20, pp. 361-69.
3. Y. Zhou, W.F. Gale, and T.H. North: Int. Mater. Rev., 1995, vol. 10, pp. 181-96.
4. W.D. Hopfe and J.E. Morral: Acta Metall. Mater., 1994, vol. 42, pp. 3887-94.
5. M.S. Thompson and J.E. Morral: Acta Metall., 1986, vol. 34, pp. 2201-03.
6. C. Zener: J. Appl. Phys., 1949, vol. 20, pp. 950-53.
7. J. Askill: Tracer Diffusion for Metals, Alloys and Simple Oxides, IFI/Plenum, New York, NY, 1970.
8. J.E. Morral and R.H. Barkalow: Scripta Metall., 1982, vol. 16, pp. 593-94.
9. J.E. Ramirez and S. Liu: Weld. J., 1992, vol. 71, pp. 365s-375s.