A study on transient liquid phase diffusion bonding of Ti-22Al-25Nb alloy

Materials Science and Engineering: A

Volumn 499, Issue 1-2, 2009, Pages 101-105

  Zou, Gui Sheng ^a,b   Xie, Er Hu ^a,b   Bai, Hai Lin ^a,b   Wu, Ai Ping ^a,b   Wang, Qing ^a,b   Ren, Jia Lie ^a,b  

^a TSINGHUA UNIVERSITY   (China)

^b BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

Author keywords

Microstructures; Ti2AlNb alloy; TLP diffusion bonding

Indexed keywords

ALUMINUM ALLOYS; COOLING; COPPER ALLOYS; DIFFUSION; DIFFUSION BONDING; MICROSTRUCTURE; NIOBIUM ALLOYS; TENSILE STRENGTH; TITANIUM ALLOYS;

BONDING TEMPERATURES; BONDING ZONE; COOLING TECHNOLOGY; HOLDING TIME; JOINT STRENGTH; RAPID COOLING; SLOW COOLING; TI2ALNB ALLOY; TLP DIFFUSION BONDING; TRANSIENT LIQUID-PHASE DIFFUSION BONDING;

TERNARY ALLOYS;

EID: 55949122679     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.11.104     Document Type: Article

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