Microstructural evolution during transient liquid-phase bonding in a Ni-base superalloy/sapphire fiber composite

Journal of Materials Science

Volumn 34, Issue 21, 1999, Pages 5187-5197

  Tseng, M W ^a   Williams, D B ^a   Soni, K K ^b,c   Levi Setti, R ^b  

^a Lehigh University   (United States)

^b UNIVERSITY OF CHICAGO   (United States)

^c Science and Technology Group ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BORON; FIBERS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; HIGH TEMPERATURE APPLICATIONS; INFILTRATION; LIQUIDS; MELTING; SAPPHIRE; SEGREGATION (METALLOGRAPHY); SOLIDIFICATION; SUPERALLOYS;

MICROCHEMICAL ANALYSIS; NICKEL BASE SUPERALLOY; SAPPHIRE FIBER; TRANSIENT LIQUID PHASE BONDING;

COMPOSITE MATERIALS;

EID: 0033225134     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004707812417     Document Type: Article

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