Microstructure development during transient liquid phase bonding of GTD-111 nickel-based superalloy

Journal of Alloys and Compounds

Volumn 461, Issue 1-2, 2008, Pages 641-647

  Pouranvari, M ^a   Ekrami, A ^a   Kokabi, A H ^a  

^a SHARIF UNIVERSITY OF TECHNOLOGY   (Iran)

Author keywords

GTD 111 superalloy; Isothermal solidification; Microstructure; TLP bonding

Indexed keywords

AMORPHOUS MATERIALS; EUTECTICS; MICROSTRUCTURE; NICKEL ALLOYS; PRECIPITATES; SCANNING ELECTRON MICROSCOPY; SOLIDIFICATION;

ISOTHERMAL SOLIDIFICATION; TRANSIENT LIQUID PHASE (TLP) BONDING;

SUPERALLOYS;

EID: 44649195045     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.07.108     Document Type: Article

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