Modelling the transient liquid phase bonding behaviour of a duplex stainless steel using copper interlayers

Materials Science and Engineering: A

Volumn 385, Issue 1-2, 2004, Pages 220-228

  Padron, T ^a   Khan, T I ^a   Kabir, M J ^b  

^a UNIVERSITY OF CALGARY   (Canada)

^b BRUNEL UNIVERSITY   (United Kingdom)

Author keywords

Duplex stainless steel; Modelling; TLP bonding

Indexed keywords

COPPER; DIFFUSION; GRAIN BOUNDARIES; MATHEMATICAL MODELS; SOLIDIFICATION;

GRAIN BOUNDARY DIFFUSIVITIES; ISOTHERMAL SOLIDIFICATION; LIQUID PHASE BOUNDARY BEHAVIOR;

STAINLESS STEEL;

COPPER; HOMOGENIZATION; SOLIDIFICATION; STAINLESS STEEL;

EID: 7244257709     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2004.06.034     Document Type: Article

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