Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal

Journal of Phase Equilibria

Volumn 20, Issue 3, 1999, Pages 199-206

  Ohsasa, K ^a   Shinmura, T ^b   Narita, T ^a  

^a HOKKAIDO UNIVERSITY   (Japan)

^b HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COOLING; DIFFUSION IN SOLIDS; DISSOLUTION; FILLER METALS; FINITE DIFFERENCE METHOD; MATHEMATICAL MODELS; NICKEL ALLOYS; PHASE INTERFACES; SOLIDIFICATION; TERNARY SYSTEMS; THERMODYNAMICS;

TRANSIENT LIQUID PHASE (TLP) BONDING;

NICKEL;

EID: 0032665791     PISSN: 10549714     EISSN: None     Source Type: Journal    
DOI: 10.1361/105497199770335721     Document Type: Article

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