Strength of joints produced by transient liquid phase bonding in the Cu-Sn system

Acta Materialia

Volumn 53, Issue 7, 2005, Pages 2019-2027

  Bosco, N S ^a   Zok, F W ^a  

^a University of California   (United States)

Author keywords

Copper; Electron beam methods; Fracture; Intermetallic phases; Toughness

Indexed keywords

ADDITION REACTIONS; COPPER; DISPERSIONS; FRACTURE; INTERMETALLICS; JOINTS (STRUCTURAL COMPONENTS); MICROSTRUCTURE; SOLID SOLUTIONS; STRENGTH OF MATERIALS; TIN; TOUGHNESS;

BANDGAP DEVICES; ELECTRON BEAM METHODS; INTERMETALLIC PHASES; TRANSIENT LIQUID PHASE (TLP) BONDING;

BONDING;

EID: 14544289998     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2005.01.013     Document Type: Article

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