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Volumn 30, Issue 8, 2004, Pages 2121-2127

Transient liquid phase bonding of alumina to alumina via boron oxide interlayer

Author keywords

A. Joining; B2O3; D. Al2O3; Transient liquid phase bonding

Indexed keywords

BORON COMPOUNDS; CERAMIC MATERIALS; DIFFUSION; FRACTURE; MORPHOLOGY; OXIDATION RESISTANCE; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

EID: 7544227246     PISSN: 02728842     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ceramint.2003.11.018     Document Type: Article
Times cited : (20)

References (10)
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  • 2
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    • Ceramic joining: Partial transient liquid-phase bonding of alumina via Cu/Pt interlayer
    • Shalz M.L., Dalgleish B.J., Tomsia A.P., Glaeser A.M. Ceramic joining: partial transient liquid-phase bonding of alumina via Cu/Pt interlayer. J. Mater. Sci. 28:1993;1673-1684.
    • (1993) J. Mater. Sci. , vol.28 , pp. 1673-1684
    • Shalz, M.L.1    Dalgleish, B.J.2    Tomsia, A.P.3    Glaeser, A.M.4
  • 3
    • 0028445532 scopus 로고
    • Ceramic joining II: Partial transient liquid-phase bonding of alumina via Cu/Ni/Cu multilayer interlayer
    • Shalz M.L., Dalgleish B.J., Tomsia A.P., Glaeser A.M. Ceramic joining II: partial transient liquid-phase bonding of alumina via Cu/Ni/Cu multilayer interlayer. J. Mater. Sci. 29:1994;3200-3208.
    • (1994) J. Mater. Sci. , vol.29 , pp. 3200-3208
    • Shalz, M.L.1    Dalgleish, B.J.2    Tomsia, A.P.3    Glaeser, A.M.4
  • 4
    • 0028468259 scopus 로고
    • Ceramic joining III: Bonding of alumina via Cu/Nb/Cu interlayer
    • Shalz M.L., Dalgleish B.J., Tomsia A.P., Glaeser A.M. Ceramic joining III: bonding of alumina via Cu/Nb/Cu interlayer. J. Mater. Sci. 29:1994;3678-3690.
    • (1994) J. Mater. Sci. , vol.29 , pp. 3678-3690
    • Shalz, M.L.1    Dalgleish, B.J.2    Tomsia, A.P.3    Glaeser, A.M.4
  • 5
    • 0032641507 scopus 로고    scopus 로고
    • Development, characterization and interface analysis of interconnections based on an isothermal solidification process
    • Suganuma P.L., Bhatnagar S.K., Chang L.S., Gust W. Development, characterization and interface analysis of interconnections based on an isothermal solidification process. Z. Metallk. 7:1999;470-474.
    • (1999) Z. Metallk. , vol.7 , pp. 470-474
    • Suganuma, P.L.1    Bhatnagar, S.K.2    Chang, L.S.3    Gust, W.4
  • 6
    • 0033076431 scopus 로고    scopus 로고
    • Applying TLP bonding to the joining of structural intermetallic compounds
    • W.F. Gale, Applying TLP bonding to the joining of structural intermetallic compounds, React. Liquid Proc. Feb. (1999) 49-52.
    • (1999) React. Liquid Proc. Feb. , pp. 49-52
    • Gale, W.F.1
  • 7
    • 0030698492 scopus 로고    scopus 로고
    • The use of transient FGM interlayers for joining advanced ceramics
    • Glaeser A.M. The use of transient FGM interlayers for joining advanced ceramics. Composites: Part B. 28B:1997;71-84.
    • (1997) Composites: Part B , vol.28 B , pp. 71-84
    • Glaeser, A.M.1
  • 8
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    • Joining of silicon nitride via a transient liquid
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    • (1997) Scripta Mater. , vol.36 , pp. 1167-1173
    • Paulasto, M.1    Ceccone, G.2    Petevs, S.D.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.