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Volumn 380, Issue 1-2, 2004, Pages 394-401

Interfacial microstructure and strength of partial transient liquid-phase bonding of silicon nitride with Ti/Ni multi-interlayer

Author keywords

Diffusion bonding; Interfacial microstructure; Joint strength; Silicon nitride; Transient liquid phase

Indexed keywords

CERAMIC MATERIALS; INTERFACES (MATERIALS); MICROSTRUCTURE; OPTIMIZATION; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

EID: 3242731064     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2004.04.012     Document Type: Article
Times cited : (49)

References (27)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.