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Volumn 380, Issue 1-2, 2004, Pages 394-401
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Interfacial microstructure and strength of partial transient liquid-phase bonding of silicon nitride with Ti/Ni multi-interlayer
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Author keywords
Diffusion bonding; Interfacial microstructure; Joint strength; Silicon nitride; Transient liquid phase
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Indexed keywords
CERAMIC MATERIALS;
INTERFACES (MATERIALS);
MICROSTRUCTURE;
OPTIMIZATION;
SCANNING ELECTRON MICROSCOPY;
X RAY DIFFRACTION ANALYSIS;
INTERFACIAL MICROSTRUCTURE;
JOINT STRENGTH;
SILICON NITRIDE;
JOINT;
MICROSTRUCTURE;
SILICON NITRIDE;
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EID: 3242731064
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/j.msea.2004.04.012 Document Type: Article |
Times cited : (49)
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References (27)
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