Wettability and Interfacial Reaction between Alumina and Cu-Based Alloys

Journal of Materials Synthesis and Processing

Volumn 6, Issue 4, 1998, Pages 271-277

  Nakashima, Kunihiko ^a  

^a KYUSHU UNIVERSITY   (Japan)

Author keywords

Alumina; Cu based alloy; PTLP bonding; Wettability

Indexed keywords

EID: 31444433856     PISSN: 10647562     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (2)

1. M. L. Shalz, B. J. Dalgleish, A. P. Tomsia, and A. M. Glaeser, J. Mater. Sci. 29, 3200 (1994).
2. B. J. Dalgleish, A. P. Tomsia, K. Nakashima, M. Locatelli, and A. M. Glaeser, Scripta Metall. Mater. 31, 1043 (1994).