A diffusional model for transient liquid phase bonding

Acta Materialia

Volumn 45, Issue 2, 1997, Pages 701-707

  Cain, S R ^a   Wilcox, J R ^a   Venkatraman, R ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; COMPUTER SIMULATION; HEATING; MATHEMATICAL MODELS; METALLIC FILMS;

DIFFUSIONAL MODEL; HEATING RATE; SOLID PHASE COMPOSITION; TRANSIENT LIQUID PHASE BONDING;

BONDING;

EID: 0031076991     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(96)00188-7     Document Type: Article

References (7)

1. L. Buene, Thin Solid Films 47, 159 (1977).
2. H, Okamoto and T. B. Massalski, in Binary Alloy Phase Diagrams (edited by T. B. Massalski), Vol. 1, pp. 315-317. American Society for Metals, Metals Park, OH (1986).
3. B. Hugsted, L. Buene, T. Finstad, O. Lønsjø and T. Olsen, Thin Solid Films 98, 81 (1982).
4. R. Venkatramen, J. R. Wilcox and S. R. Cain, Metall. Mater. Trans., accepted.
5. I. Tuah-Poku, M. Dollar and T. B. Massalski, Metall. Trans. A 19A, 675 (1988).
6. S. V. Patankar, Numerical Heat Transfer and Fluid Flow, pp. 41. Hemisphere, Washington, DC (1980).
7. For a theoretical treatment of the moving boundary problem, see W. Jost, Diffusion in Solids, Liquids, and Gases, pp. 68-77. Academic Press, New York, NY (1960).