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Materials Transactions

Volumn 44, Issue 5, 2003, Pages 819-823

Phase-field simulation of transient liquid phase bonding process of Ni using Ni-P binary filler metal

(3) Natsume, Yukinobu a Ohsasa, Kenichi a Narita, Toshio a

a HOKKAIDO UNIVERSITY (Japan)

Author keywords

Dissolution; Isothermal solidification; Nickel; Phase field; Phosphorus; Simulation; Transient liquid phase bonding

Indexed keywords

BONDING; DISSOLUTION; INTERFACES (MATERIALS); NICKEL; PHOSPHORUS; SOLIDIFICATION;

TRANSIENT LIQUID PHASE BONDING;

FILLERS;

EID: 0038119306 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.44.819 Document Type: Article

Times cited : (31)

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