An evaluation of the partial transient liquid phase bonding of Si3 N4 using Au coated Ni-22Cr foils

Acta Materialia

Volumn 44, Issue 2, 1996, Pages 657-667

  Ceccone, G ^a   Nicholas, M G ^a   Peteves, S D ^a   Tomsia, A P ^b,c   Dalgleish, B J ^b,c   Glaeser, A M ^b,c  

^a JOINT RESEARCH CENTRE   (Italy)

^b Lawrence Berkeley National Laboratory   (United States)

^c LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BENDING STRENGTH; CHEMISTRY; INTERFACES (MATERIALS); METAL FOIL; MICROANALYSIS; MICROSTRUCTURE; MULTILAYERS; SCANNING ELECTRON MICROSCOPY; SILICON NITRIDE; SOLID SOLUTIONS; THERMAL EFFECTS;

ELECTRON PROBE MICROANALYSIS; GOLD COATED NICKEL CHROMIUM FOIL; INTERLAYER THICKNESS EFFECT; MULTILAYER INTERLAYERS; OPTIMIZED DIFFUSION BONDING; PARTIAL TRANSIENT LIQUID PHASE BONDING; POST BONDING ANNEALING;

BONDING;

EID: 0030083272     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/1359-6454(95)00187-5     Document Type: Article

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