Transient liquid phase (TLP) bonding of Al7075 to Ti-6Al-4V alloy

Materials Characterization

Volumn 61, Issue 3, 2010, Pages 312-317

  AlHazaa, A ^a   Khan, T I ^a   Haq, I ^a  

^a UNIVERSITY OF CALGARY   (Canada)

Author keywords

Aerospace alloys; Eutectic; Grains; Interlayers; Microstructure; TLP bonding

Indexed keywords

AEROSPACE ALLOYS; BOND INTERFACE; BOND STRENGTH; BONDING TIME; CU INTERLAYERS; EUTECTIC FORMATION; EUTECTIC GRAINS; EUTECTIC PHASIS; ISOTHERMAL SOLIDIFICATION; JOINT FORMATION; MATRIX; PHASE FORMATIONS; SEM; SOLID-STATE DIFFUSION; TI ALLOYS; TI-6AL-4V; TI-6AL-4V ALLOY; TLP BONDING; TRANSIENT LIQUID PHASE BONDING; XPS;

ALLOYS; ALUMINUM; CERIUM ALLOYS; COPPER ALLOYS; DIFFUSION IN SOLIDS; EUTECTICS; GRAIN BOUNDARIES; MICROSTRUCTURE; PHASE INTERFACES; ZINC;

TITANIUM ALLOYS;

EID: 77349104666     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2009.12.014     Document Type: Article

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