Modelling wide gap TLP bonding of Ti-48 at.-%Al-2 at.-%Cr-2 at.-%Nb alloys

Materials Science and Technology

Volumn 19, Issue 8, 2003, Pages 1084-1090

  Zhou, T ^a,b   Gale, W F ^a  

^a AUBURN UNIVERSITY   (United States)

^b UNIVERSITY OF CONNECTICUT   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; HEAT TREATMENT; ISOTHERMS; SOLIDIFICATION; SOLUBILITY;

TRANSIENT LIQUID PHASES (TLP);

TITANIUM ALLOYS;

ALUMINUM; CHROMIUM DERIVATIVE; NIOBIUM; TITANIUM;

ARTICLE; CHEMICAL ANALYSIS; CHEMICAL BOND; DIFFUSION COEFFICIENT; HEAT; MELTING POINT; MOLECULAR MODEL; PARTICLE SIZE; PHASE TRANSITION; SOLUBILITY; STEADY STATE; TEMPERATURE DEPENDENCE;

EID: 0042320574     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/026708303225004594     Document Type: Article

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