Partial transient liquid-phase bonding of Si3N4 with Ti/Cu/Ni multi-interlayers

Journal of Materials Science Letters

Volumn 16, Issue 24, 1997, Pages 2026-2028

  Zheng, Chen ^a,b   Lou, Hongqing ^b   Fei, Zhou ^a   Li, Zhezhang ^a  

^a ZHEJIANG UNIVERSITY   (China)

^b JIANGSU UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; COMPOSITION EFFECTS; COPPER; CRYSTAL MICROSTRUCTURE; INTERFACES (MATERIALS); MICROANALYSIS; NICKEL; SCANNING ELECTRON MICROSCOPY; TITANIUM; X RAY DIFFRACTION ANALYSIS;

ELECTRON PROBE MICROANALYSIS (EPMA); ENERGY DISPERSIVE X RAY (EDX) ANALYSIS; FOUR POINT BEND TESTS; PARTIAL TRANSIENT LIQUID PHASE (PLTP) BONDING;

SILICON NITRIDE;

EID: 0031374967     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1018548414552     Document Type: Article

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