Interface evolution of TiAl/Ti6242 transient liquid phase joint using Ti, Cu foils as insert metals

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 15, Issue 2, 2005, Pages 375-378

  Duan, Hui Ping ^a   Bohm, K H ^b   Ventzke, V ^b   Kocak, M ^b  

^a BEIHANG UNIVERSITY   (China)

^b INSTITUTE OF MATERIALS RESEARCH   (Germany)

Author keywords

Interface evolution; Intermetallics; Mechanism; Ti6242 transient liquid phase bonding; TiAl

Indexed keywords

ADHESIVE JOINTS; AIRCRAFT MATERIALS; ALUMINUM ALLOYS; BONDING; INTERFACES (MATERIALS); INTERMETALLICS;

INTERFACE EVOLUTION; SURFACE OXIDE LAYER; TIAL/TI6242 JOINT; TRANSIENT LIQUID PHASE BONDING;

TITANIUM ALLOYS;

EID: 20144373538     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (15)

1. Shirzadi A A, Wallach E R. Temperature gradient transient liquid phase diffusion bonding: a new method for joining advanced materials[J]. Science and Technology of Welding and Joining, 1997, 2(3): 89-94.
2. Khan T I, Wallach E R. Transient liquid phase diffusion bonding and associated recrystallization phenomenon when joining ODS ferritic superalloys[J]. Journal of Materials Science, 1996, 31: 2937-2943.
3. MacDonald W D, Eagar T W, Cieslak M J, et al. Transient liquid phase bonding processes[A]. The Metal Science of Joining, the Minearals[C]. TMS Warkendale Penn: Metals and Materials Society, 1992. 93-100.
4. 4-to inconel 718 joints[J]. Mater Sci Eng A, 2003, 344A: 240-244.
5. Zhang J X, Chandel R S, Chen Y Z, et al, Effect of residual stress on the strength of an alumina-steel joint by partial transient liquid phase (PTLP) brazing[J]. Journal of Materials Processing Technology, 2002, 122: 220-225.
6. Gale W F, Orel S V. A microstructural investigation of NiAl/Ni-Si-B/NiAl transient liquid phase bonds[J]. Journal of Materials Science, 1996, 31: 345-349.
7. Gale W F, Guan Z. Transient liquid-phase bonding in the NiAl/Cu/Ni system-a microstructural investigation[J]. Metall Mater Trans A, 1996, 27A: 3621-3629.
8. Moore T J, Kalinowski J M. Diffusion brazing NiAl with self-generated filler metal, high-temperature ordered intermetallic alloys V[J]. Materials Research Society Symposium Proceedings, 1993, 288: 1173-1178.
9. Strum M J, Henshall G A, Flore N F, et al. Liquidassisted diffusion bonding of NiAl[A]. Advanced Joining Technologies for New Materials II[C]. Miami, FL:AWS, 1994: 76-88.
10. Butts D A, Gale W F, Zhou T. Transient liquid phase(TLP) bonding of TiAl-alloys: wettability, microstructure, mechanical properties and potential for automation[A]. The 6th International Trends in Welding Research Conference Proceedings[C]. Pine Mountain, GA: ASM International, 2003. 495-499.
11. Fergus J W, Zhou T, Dang B, et al. Oxidation resistance of transient liquid phase (TLP)-bonded gamma titanium aluminide[A]. 6th International Trends in Welding Research Conference Proceedings[C]. Pine Mountain, GA: ASM International, 2003: 799-803.
12. Gale W F, Orel S V. Microstructural development in NiAl/Ni-Si-B/Ni transient liquid phase bonds[J]. Metall Mater Trans A, 1996, 27A: 1925-1931.
13. Gale W F, Wallach E R. Microstructural development in transient liquid-phase bonding[J]. Metall Trans A, 1991, 22A: 2451-2457.
14. Gale W F, Guan Z. Transient liquid-phase bonding in the NiAl/Cu/Ni system-a microstructural investigation[J]. Metall Mater Trans A, 1996, 27A: 3621-3629.
15. Gale W F, Abdo Z A M. Bulk-alloy microstructural analogues for transient liquid-phase bonds in the NiAl/Cu/Ni system[J]. Metall Mater Trans A, 1999, 30A: 3111-3124.