Applying TLP Bonding to the Joining of Structural Intermetallic Compounds

JOM

Volumn 51, Issue 2, 1999, Pages 49-52

  Gale, William F ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DISSOLUTION; LIQUID METALS; METALLOGRAPHIC MICROSTRUCTURE; SOLIDIFICATION; SUBSTRATES; WETTING;

HOMOGENIZATION; ISOTHERMAL SOLIDIFICATION; REACTIVE LIQUIDS; TRANSIENT-LIQUID-PHASE (TLP) BONDING;

INTERMETALLICS;

EID: 0033076431     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-999-0210-8     Document Type: Article

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