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Materials Transactions

Volumn 42, Issue 2, 2001, Pages 292-297

Isothermal solidification behavior during the transient liquid phase bonding process of nickel using binary filler metals

(3) Shinmura, T a Ohsasa, K a Narita, T a

a HOKKAIDO UNIVERSITY (Japan)

Author keywords

Boron; Copper; Diffusion; Filler metal; Isothermal solidification; Nickel; Phosphorus; Transient liquid phase bonding

Indexed keywords

BINARY ALLOYS; CHEMICAL BONDS; COMPUTER SIMULATION; DIFFUSION; MATHEMATICAL MODELS; NUMERICAL ANALYSIS; SOLIDIFICATION;

TRANSIENT LIQUID PHASE (TLP) BONDING;

FILLER METALS;

EID: 0034985832 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.42.292 Document Type: Article

Times cited : (28)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.