Effect of bonding temperature on isothermal solidification rate during transient liquid phase bonding of Inconel 738LC superalloy

Materials Science and Engineering: A

Volumn 397, Issue 1-2, 2005, Pages 98-112

  Idowu, O A ^a   Richards, N L ^a   Chaturvedi, M C ^a  

^a UNIVERSITY OF MANITOBA   (Canada)

Author keywords

Diffusion brazing; IN 738LC; Nicrobraz 150; Superalloys; TLP bonding

Indexed keywords

CHEMICAL BONDS; ISOTHERMS; MATHEMATICAL MODELS; NICKEL ALLOYS; SOLIDIFICATION; THERMAL EFFECTS;

BONDING TEMPERATURE; ISOTHERMAL SOLIDIFICATION; SOLIDIFICATION RATES; TRANSIENT LIQUID PHASE (TLP) MODELS;

SUPERALLOYS;

SUPERALLOY;

EID: 17644427345     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2005.01.055     Document Type: Article

References (28)

1. J.H.G. Mattheij Mater. Sci. Technol. 1 8 1985 608-612
2. S.D. Duvall W.A. Owczarski Weld. J. 46 9 1967 423s-432s
3. M.H. Haafkens G.H. Matthey Weld. J. 61 25 1982 25-30
4. O.A. Ojo N.L. Richards M.C. Chaturvedi Scripta Mater. 50 2004 641-646
5. S.D. Duvall W.A. Owczarski D.F. Paulonis Weld. J. 53 4 1974 203-214
6. G. Humpston D.M. Jacobson ASM Int. 1996 128-129
7. R. Thamburaj W. Wallace J.A. Goldak Int. Mater. Rev. 28 1 1983 1-22
8. K. Nishimoto K. Saida D. Kim Y. Nakao ISIJ Int. 35 10 1995 1298-1306
9. O.A. Ojo N.L. Richards M.C. Chaturvedi Sci. Technol. Weld. Joining 9 3 2004 209-220
10. C.W. Sinclair J. Phase Equilib. 20 4 1999 361-369
11. C.W. Sinclair G.R. Purdy J.E. Morral Metall. Trans. A. 31A 2000 1187-1192
12. K. Ohsasa T. Shinmura T. Narita J. Phase Equilib. 20 3 1999 199-206
13. W.F. Gale E.R. Wallach Mater. Sci. Technol. 7 1991 1143-1148
14. O.A. Ojo, N.L. Richards, M.C. Chaturvedi, Isothermal solidification during transient liquid phase bonding of Inconel 738 superalloy, Sci. Technol. Weld. Joining, in press.
15. W.F. Gale E.R. Wallach Metall. Trans. A. 22A 1991 2451-2457
16. J. Crank The Mathematics of Diffusion second ed. 1975 Oxford University Press Oxford, UK p. 37
17. Y. Nakao K. Nishimoto K. Shinozaki C.Y. Kang Trans. Jpn. Weld. Soc. 20 1 1989 60-65
18. R. Rosenthal D.R.F. West Mater. Sci. Technol. 15 12 1999 1387-1394
19. R. Sallemark, Progress Report 2, Cost 50 Programme Sweeden, 1975.
20. J.E. Ramirez S. Liu Weld. J. 71 1992 365s-375s
21. W.D. MacDonald T.W. Eagar Metall. Trans. A 29A 1998 315-326
22. I. Tuah-Poku M. Dollar T.B. Massalski Metall. Trans. A 19A 1988 675-686
23. Y. Zhou W.F. Gale T.H. North Int. Mater. Rev. 40 5 1995 181-196
24. S. Liu D.L. Olson G.P. Martin G.R. Edwards Weld. J. 70 8 1991 207s-215s
25. W.D. MacDonald T.W. Eagar Transient liquid phase bonding processes In: M.J. Cleslak J.H. Perepezko S. Kang M.E. Glicksman (Eds.) The Metal Science of Joining 1992 The Minerals, Metals and Materials Society 93-100
26. S.V. Orel L. Parous W.F. Gale Transient liquid phase bonding of NiAl using Ni-Si-B interlayers Advanced Joining Technologies for New Materials II 2-4 March 1994 American Welding Society Florida pp. 5-19
27. S.V. Orel L. Parous W.F. Gale Weld. J. 74 9 1995 319s-324s
28. M. Taha A.W. Kurz Z. Metallkd. 72 8 1981 546-549