Microstructural development in NiAl/Ni-Si-B/Ni transient liquid phase bonds

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 27, Issue 7, 1996, Pages 1925-1931

  Gale, W F ^a   Orel, S V ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; BORIDES; COOLING; HEATING; INTERFACES (MATERIALS); MARTENSITE; MICROSTRUCTURE; OPTICAL MICROSCOPY; PRECIPITATION (CHEMICAL); SCANNING ELECTRON MICROSCOPY; SOLIDIFICATION; TRANSMISSION ELECTRON MICROSCOPY;

CAST NEAR STOICHIOMETRIC; MELT SPUN INTERLAYERS; RESISTANCE HEATING; TRANSIENT LIQUID PHASE;

NICKEL ALLOYS;

EID: 0030192570     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02651942     Document Type: Article

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