Adhesion improvement of thermoplastic isotropically conductive adhesive

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 2, 2005, Pages 327-336

  Liong, Silvia ^a   Wong, C P ^a   Burgoyne Jr , William F ^b  

^a Georgia Institute of Technology   (United States)

^b AIR PRODUCTS AND CHEMICALS INC   (United States)

Author keywords

Isotropically conductive adhesive (ICA); Polyarylene ether (PAE2)

Indexed keywords

ABSORPTION; ADHESION; ANISOTROPY; CONDUCTIVE PLASTICS; CORROSION RESISTANCE; ELECTRIC CONDUCTIVITY; MOISTURE; POLYETHERS; SURFACE PROPERTIES; THERMOPLASTICS;

CONTACT RESISTANCE STABILITY; ISOTROPICALLY CONDUCTIVE ADHESIVE (ICA); MOISTURE ABSORPTION; POLYARYLENE ETHER (PAE2);

PLASTIC ADHESIVES;

EID: 21044459040     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848484     Document Type: Article

References (12)

1. D. Lu, C. Wong, and Q. K. Tong, "Mechanisms underlying the unstable contact resistance of conductive adhesives," IEEE Trans. Compon., Packag., Manufact. Technol. C, vol. 22, no. 3, pp. 228-232, Jul. 1999.
2. K. Gilleo, "Introduction to conductive adhesive joining technology," in Conductive Adhesives for Electronics Packaging, J. Liu, Ed. London, U.K.: Electrochemical Publ., 1999.
3. J. E. Morris, "Conduction mechanisms and microstructure development in isotropic electrically conductive adhesives," in Conductive Adhesives for Electronic Packaging, J. Liu, Ed. London, U.K.: Electrochemical Publ., 1999.
4. D. A. Jones, Principles and Prevention of Corrosion, 2nd ed. Englewood Cliffs, NJ: Prentice-Hall, 1996.
5. W. F. Burgoyne, L. M. Robeson, and R. N. Vrtis, "Nonfunctionalized Poly(Arylene Ether) Dielectrics," U.S. Patent 5 874 516, Feb. 1999.
6. S. Liong and C. P. Wong, "Development of thermoplastic isotropically conductive adhesive," in Proc. 51st Electronic Components Technology Conf., Orlando, FL, 2001, pp. 586-592.
7. A. N. Gent and G. R. Hamed, "Adhesion," in Encyclopedia of Polymer Science and Technology, J. I. Kroschwitz, H. F. Mark, N. M. Bikales, C. G. Overberger, and G. Menges, Eds. New York: Wiley, 1985, vol. 1.
8. E. P. Plueddemann, Silane Coupling Agents, 2nd ed. New York: Plenum, 1991.
9. CRC Handbook of Chemistry and Physics, 65th ed., CRC, Boca Raton, FL, 1984-1985.
10. M. Zwolinski, J. Hickman, H. Rubon, and Y. Zaks, "Electrically conductive adhesives for surface mount solder replacement," in Proc. 2nd Int. Conf. Adhesive Joining Coating Technology Electronics Manufacturing, Stockholm, Sweden, 1996.
11. B. Ellis, Epoxy Resin Technology. London, U.K.: Blackie Academic and Professional, 1993.
12. D. Lu, C. P. Wong, and Q. K. Tong, "Conductivity mechanisms of isotropic conductive adhesives," IEEE Trans. Compon., Packag., Manufact. Technol. C, vol. 22, no. 3, pp. 223-227, Jul. 1999.