Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications

Journal of Electronic Materials

Volumn 34, Issue 8, 2005, Pages 1165-1171

  Yim, M J ^a   Kim, H J ^a   Paik, K W ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Anisotropic conductive adhesives (ACAs); Flip chip; High current density; Thermal conductivity

Indexed keywords

ADHESIVES; ANISOTROPY; CURRENT DENSITY; DEGRADATION; INTERCONNECTION NETWORKS; SEMICONDUCTOR JUNCTIONS; THERMAL CONDUCTIVITY;

ANISOTROPIC CONDUCTING ADHESIVES (ACA); FLIP CHIP; FLIP CHIP JOINT; HIGH CURRENT DENSITY;

FLIP CHIP DEVICES;

EID: 24144455396     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0246-7     Document Type: Article

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