High performance Electrically Conductive Adhesives (ECAs) modified with novel

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1648-1652

  Li, Yi ^a   Whitman, Andrew ^a   Moon, Kyoung Sik ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICALLY CONDUCTIVE ADHESIVES (ECA); LEAD SOLDERS; OXIDATION PRODUCTS; PHYSICAL CONTACTS;

CARBOXYLIC ACIDS; DYNAMIC MECHANICAL ANALYSIS; ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; FILLERS; MODIFICATION; MOLECULAR STRUCTURE; OXIDATION; SOLDERING ALLOYS;

ADHESIVES;

EID: 24644517224     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

1. J. C. Jagt, "Reliability of Electrically Conductive Adhesive Joints for Surface Mount Applications: A Summary of the State of the Art," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 21, No. 2, 1998, p. 215-225.
2. G. Nguyen, J. Williams, F. Gibson, and T. Winster, "Electrical Reliability of Conductive Adhesives for Surface Mount Applications," Proceedings of International Electronic Packaging Conference, 1993, pp. 479-486.
3. G. Nguyen, J. Williams, and F. Gibson, "Conductive Adhesives: Reliable and Economical Alternatives to Solder Paste for Electrical Applications," ISHM Proceedings, 1992, pp. 510-517.
4. J. C. Jagt, P.J.M. Beric and G.F.C.M. Lijten, "Electrically Conductive Adhesives: A Prospective Alternative for SMD Soldering?," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B. Vol. 18, No. 2 (1995), pp. 292-298.
5. M. Zwolinski, J. Hickman, H. Rubon, and Y. Zaks, "Electrically Conductive Adhesives for Surface Mount Solder Replacement," Proceedings of the 2nd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Stockholm, Sweden, June 3-5,1996, pp. 333-340.
6. J. C. Jagt, P.J.M. Beric and G.F.C.M. Lijten, "Electrically Conductive Adhesives: A Prospective Alternative for SMD Soldering?," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, 18(2): pp. 292-298, 1995.
7. H. Botter, "Factors That Influence the Electrical Contact Resistance of Isotropic Conductive Adhesive Joints During Climate Chamer Testing," Proceedings of the 2nd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, (Stockholm, Sweden), pp.30-37, June 1996.
8. C.P. Wong, D. Lu, S. Vona, and Q.K. Tong, "A Fundamental Study of Electrically Conductive Adhesives," Proceedings of the 1st IEEE International Symposium on Polymeric Electronics Packaging, (Norrkoping, Sweden), pp. 80-85, 1997.
9. K. Gilleo, "Assembly with Conductive Adhesives," Soldering and Surface Mount Technology, No. 19, pp. 12-17, Feb. 1995.
10. P.G. Hariss, "Conductive Adhesives: A Critical Review of Progress to Date," Soldering and Surface Mount Technology, No. 20, pp. 19-21, May 1995.
11. Yi Li and C.P. Wong, "Recent Advances in Electrical Conductive Adhesives", IEEE Proceedings Polytronic 2004 4th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Portland, OR, Sept. 14-16, 2004, p. 1-7(2004).
12. D. Lu, Q. K. Tong, C. P. Wong, "A Study of Lubricants on Silver Flakes for Microelectronic Conductive Adhesives," IEEE Trans. on Components and Packaging Technology, Vol. 22, No. 4, p. 365-371 (1999).
13. Yi Li, Kyoung-sik Moon, Haiying Li and C. P. Wong, "Conductivity Improvement of Isotropic Conductive Adhesives with Short-Chain Dicarboxylic Acids", Proceedings of 54th IEEE Electronic Components and Technology Conference, Las Vegas, Nevada, June 1-4, 2004, p.1959.
14. D. Lu, Q.K. Tong, and C.P. Wong, "Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C, 1999, Vol. 22, No. 3, 1999, pp.228-232.