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Volumn 99, Issue 4, 2006, Pages 1665-1673
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Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering
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Author keywords
Anisotropically conductive adhesives; Epoxy resins; Interfaces; Nanocomposite; Sintering
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Indexed keywords
ANISOTROPICALLY CONDUCTIVE ADHESIVES;
INTERFACES;
NANOCOMPOSITES;
ADHESIVES;
ELECTRIC PROPERTIES;
MELTING;
NANOSTRUCTURED MATERIALS;
SINTERING;
SOLDERED JOINTS;
JOINTS (STRUCTURAL COMPONENTS);
ADHESIVE AGENT;
ANISOTROPY;
ELECTRICAL PROPERTY;
EPOXY RESIN;
NANOCOMPOSITE;
SILVER;
SINTERING;
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EID: 33644767350
PISSN: 00218995
EISSN: 10974628
Source Type: Journal
DOI: 10.1002/app.22509 Document Type: Article |
Times cited : (63)
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References (16)
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