메뉴 건너뛰기




Volumn 99, Issue 4, 2006, Pages 1665-1673

Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering

Author keywords

Anisotropically conductive adhesives; Epoxy resins; Interfaces; Nanocomposite; Sintering

Indexed keywords

ANISOTROPICALLY CONDUCTIVE ADHESIVES; INTERFACES; NANOCOMPOSITES;

EID: 33644767350     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.22509     Document Type: Article
Times cited : (63)

References (16)
  • 5
    • 33645134002 scopus 로고
    • January, February 1994, 50
    • Gilleo, K. Circuits Assembly January 1994, 52; February 1994, 50.
    • (1994) Circuits Assembly , pp. 52
    • Gilleo, K.1
  • 11
    • 0003512080 scopus 로고    scopus 로고
    • Liu, J., Ed. Electrochemical Publications: British Isles
    • Liu, J., Ed. Conductive adhesives for Electronics Packaging; Electrochemical Publications: British Isles, 1999.
    • (1999) Conductive Adhesives for Electronics Packaging


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.