Effect of temperature on the cure shrinkage measurement of non-conductive adhesives for flip chip interconnects

Journal of Materials Research

Volumn 20, Issue 5, 2005, Pages 1324-1329

  Yu, H ^a   Mhaisalkar, S G ^a   Wong, E H ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; ELECTRIC CONDUCTIVITY; ELECTRIC CONTACTS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; GELATION; SHRINKAGE; SOLDERING ALLOYS; THERMAL EFFECTS; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT;

CURE SHRINKAGE MEASUREMENT; ELECTRICAL CONNECTIVITY; FLIP CHIP INTERCONNECTS; LEAD-FREE SOLDER; NON-CONDUCTIVE ADHESIVES;

ADHESIVES;

EID: 24144475214     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2005.0159     Document Type: Article

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