New flip Chip technology utilizing non-conductive adhesive adapted for high volume Chip card module production

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 29, Issue , 2004, Pages 165-170

  Pajonk, Joachim ^a  

^a 8800 FC DATACON Semiconduct E GmbH   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; BONDING; COST EFFECTIVENESS; FLIP CHIP DEVICES; METALLIZING; SOLDERED JOINTS; STABILITY; VOLUME MEASUREMENT; WSI CIRCUITS;

CHIP CARDS; CHIP-ON-BOARD PROCESS (COB); HIGH VOLUME CHIP CARD; REEL-TO-REEL CONFIGURATION;

MICROPROCESSOR CHIPS;

EID: 4644372562     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Oppermann, H.H., Aschenbrenner, R., Reichl, H.: "Advanced Flip Chip Technologies"
2. Reinert, W., Harder, T., "Performance of the Stud Bump Bonding with ICA in Comparison to Solder FC", Adhesives in Electronics 2000, p. 136
3. Li, L., Fang, T., "ACA Films for FC on flex Packages", Adhesives in Electronics 2000, p. 129
4. Chenuz, J.M., Clot, Ph., Zeberli, J.F.: "Industrial approach of a Flip-Chip method using the stud-bumps with a Non-Conductive Paste", Adhesives in Electronics 2000, Proceeding p. 205