Transient liquid phase sintering conductive adhesives as solder replacements

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 554-560

  Gallagher, Catherine ^a   Matijasevic, Goran ^a   Maguire, James F ^a  

^a Toranaga Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY OF SOLIDS; INTERFACES (MATERIALS); POLYMERS; PRINTED CIRCUIT BOARDS; SINTERING; SOLDERING; SURFACE MOUNT TECHNOLOGY;

CONDUCTIVE ADHESIVES; TRANSIENT LIQUID PHASE SINTERING (TLPS);

ADHESIVES;

EID: 0030647024     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (21)