Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate

Journal of Electronic Packaging

Volumn 127, Issue 1, 2005, Pages 43-46

  Cao, Liqiang ^a   Lai, Zonghe ^a   Liu, Johan ^a  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

Anisotropic Conductive Adhesive (ACA); Moisture Effect; Peel Strength

Indexed keywords

ANISOTROPY; ELECTRONIC EQUIPMENT; MICROSTRUCTURE; MOISTURE; PEELING; POLYIMIDES; SUBSTRATES; SURFACE CHEMISTRY;

ANISOTROPIC CONDUCTIVE ADHESIVE (ACA); MOISTURE EFFECT; PEEL STRENGTH; POLYIMIDE SUBSTRATE;

ADHESIVES;

EID: 18744398440     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1846066     Document Type: Article

References (9)

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9. Ferguson, T., and Qu, J., 2003, "Moisture Absorption Analysis of Interfacial Fracture Test Specimens Conmposed of No-Flow Underfill Materials," ASME J. Electron. Packag., 125, pp. 24-30.