Non-migration conductive adhesives

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

Volumn , Issue , 2001, Pages 79-83

  Shirai, Yukio ^a   Komagata, Mitinori ^a   Suzuki, Kenichi ^a  

^a NAMICS CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CONDUCTIVE MATERIALS; ELECTRIC RESISTANCE; ELECTROMIGRATION; SOLDERING ALLOYS;

CONDUCTIVE ADHESIVES;

ADHESIVES;

EID: 0035791096     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. T. Kawaguchi, "Present and Future of Pb-Free Solders", J.of SHM, vol. 11, No.3, pp.10-14, 1995.
2. T. Nakamura, "Lead Free Assemble Technology by Conductive Adhesives", J.of SHM, vol. 11, No.3, pp.30-35, 1995.
3. S. Nemoto, "Conductive adhesive for SMT,", J SHM, vol. 12, No.3, pp.15, 1996.
4. J.C. Bolger, J.F. McGovern, and J.M. Sylva, "Conductive epoxy surface mount adhesives for solder replacement," in Proc. Tech. Program Nat. Electron. Packag. Prod. Conf., pp. 1995, 1991.
5. M. Komagata, K. Yokoyama, Y. Tanaka, and K. Suzuki, "Nickel filled adhesives,", Japan IEMT Symp., pp.429, 1995.
6. M. Ono, Y. Tomura, Y. Bessyo, T. Shiraishi, K. Eda, and T. Ishida, "Bonding resistance of SBB technique," in Proc. Pan Pasific Microelectron. Symp., pp.355, 1997.
7. L. Li, H. Kim, C. Lizzul, I. Sacolick, and J.E. Morris, "Electrical, mechanical, structural, and processing properties of electrically conductive adhesives," IEEE Trans. Comp., Packag., Manufact. Technol., vol. 16, pp.843, 1993.
8. Kinzoku data book, pp.420, 1984.