Direct patterning using metal nano-particles

Journal of Japan Institute of Electronics Packaging

Volumn 6, Issue 2, 2003, Pages 130-135

  Matsuba, Yorishige ^a  

^a Harima Chemicals Inc   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 27344450417     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.6.130     Document Type: Article

References (3)

1. H. Iwashige, G. Kutulk, S. Hayashi, T. Suzuki, T. Yoshida, T. Abe and M. Oda: “ULSI Interconnect Formation Using Dis persed Nanoparticles”, Scripta Mater., Vol. 44, pp. 1667-1670, 2001
2. Y. Igaku, S. Matsui, H. Ishigaki, J. Fujita, M. Ishida, Y. Ochiai, H. Namatsu, M. Komuro and H. Hiroshima: “Room Temperature Nanoimprint Technology Using Hydrogen Silsequioxane (HSQ)”, Jpn. J. Appl. Phys., Vol. 41, pp. 4198-4202, 2002
3. T. K. Whidden, D. F. Ferry, M. N. Kozicki, E. Kim, A. Kumar, J. Witbur and G. M. Whitesides: “Pattern Transfer to Silicon by Microcontact Printing and RIE”, Nanotechnology, No. 7, pp. 447-451, 1996