Conductivity mechanisms of isotropic conductive adhesives (ICA's)

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 3, 1999, Pages 223-227

  Lu, Daoqiang ^a,b   Tong, Quinn K ^c   Wong, C P ^a,b  

^a IEEE

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c NATIONAL STARCH AND CHEMICAL COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE MATERIALS; CURING; ELECTRIC CONDUCTIVITY MEASUREMENT; EPOXY RESINS; FILLER METALS; LUBRICANTS; PRESSURE EFFECTS; SHRINKAGE; SOLIDIFICATION; THERMOANALYSIS;

ISOTROPIC CONDUCTIVE ADHESIVES (ICA);

PLASTIC ADHESIVES;

EID: 0033328264     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.795857     Document Type: Article

References (13)

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