Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization

Journal of Electronic Materials

Volumn 34, Issue 11, 2005, Pages 1432-1439

  Jiang, Hongjin ^a,b   Moon, Kyoung Sik ^a   Lu, Jiongxin ^a   Wong, C P ^a,b  

^a Georgia Institute of Technology   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Conductive adhesives; Nanoparticles; Surfactants

Indexed keywords

ELECTRIC CONDUCTIVITY; MORPHOLOGY; NANOSTRUCTURED MATERIALS; PARTICLE SIZE ANALYSIS; SILVER; SINTERING; SURFACE ACTIVE AGENTS;

CONDUCTIVE ADHESIVES; NANOPARTICLES;

ADHESIVES;

EID: 28044461540     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0202-6     Document Type: Article

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