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Volumn 13, Issue 2, 2004, Pages 25-28
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Global trends in lead-free soldering. Part II of a II-part series on lead-free
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Author keywords
[No Author keywords available]
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Indexed keywords
COOLING;
ELASTIC MODULI;
GLASS TRANSITION;
HEAT CONVECTION;
INFRARED HEATING;
MATHEMATICAL MODELS;
RELIABILITY;
SOLDERED JOINTS;
THERMAL EFFECTS;
TIN ALLOYS;
WATER ABSORPTION;
LEAD-FREE SOLDERING;
MOISTURE ABSORPTION RESISTANCES;
SOLDER JOINT RELIABILITY;
SOLDER REFLOW TEMPERATURES;
SOLDERING;
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EID: 1542335788
PISSN: 10650555
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Article |
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Times cited : (6)
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References (0)
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