Green IC packaging: Reinventing the integrated circuit is more than just a lead-free issue

Advanced Packaging

Volumn 10, Issue 8, 2001, Pages 33-x

  Cannis, Jeff ^a  

^a AMKOR TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0006077442     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (10)

1. D.W. Romm, B. Lange, D.C. Abbott, "Evaluation of Nickel-palladium-finished ICs with Lead-free Solder Alloys," IPC Works 2000 Proceedings, 2000.
2. D.C. Abbott et al., IEEE Trans. CHMT, 14(567), 1991.
3. D.W. Romm, D.C. Abbott, "Lead-free Solder Joint Evaluation," SMT, March 2000.
4. S. Winkler and B. Hom, "A Look at the Past Reveals a Lead-free Drop-in Replacement," HDI, April 2001.
5. R.A. Schetty, "Minimization of Tin Whisker Formation for Lead-free Electronics Finishing," IPC Works 2000 Proceedings, 2000.
6. "Lead-free Solder Project Final Report," National Center for Manufacturing Sciences, August 1997.
7. A. Syed, "Reliability of Lead-free Solder Connections for Area-array Packages," APEX 2001.
8. G. Swan et al., "Development of Lead-free Peripheral Leaded and PBGA Components to Meet MSL3 260°C Peak Reflow Profile," APEX 2001.
9. NCMS High Temperature Fatigue Resistant Solder Program.
10. Bartelo et al., "Thermomechanical Fatigue Behavior of Selected Lead-free Solders," APEX 2001.