Reliability improvement of conductive adhesives on tin (Sn) surfaces

Journal of Adhesion Science and Technology

Volumn 19, Issue 16, 2005, Pages 1427-1444

  Li, Y I ^a   Moon, Kyoung Sik ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Conductive adhesives; Contact resistance; Corrosion inhibitor; Interface

Indexed keywords

CONTACT ANGLE; CORROSION INHIBITORS; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; FOURIER TRANSFORM INFRARED SPECTROSCOPY; SURFACE PHENOMENA; TIN; X RAY PHOTOELECTRON SPECTROSCOPY; CONTACT RESISTANCE; INTERFACES (MATERIALS); PASSIVATION; X RAY DIFFRACTION ANALYSIS;

CONDUCTIVE ADHESIVES; CONTACT RESISTANCE; CORROSION INHIBITOR; INTERFACE;

ADHESIVES; TIN;

BULK RESISTIVITY; CONDUCTIVE ADHESIVE; ELECTRICALLY CONDUCTIVE ADHESIVES; ELEVATED TEMPERATURE; FOURIER; GRAZING ANGLES; METAL SURFACES; ORGANIC CORROSION INHIBITORS; PASSIVATION LAYER; RELIABILITY IMPROVEMENT;

EID: 29444434458     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856105774805822     Document Type: Review

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