Conductive polymer bump interconnects

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 1059-1068

  Lin, Jong Kai ^a   Drye, James ^a   Lytle, William ^a   Scharr, Thomas ^a   Subrahmanyan, Ravi ^a   Sharma, Ravi ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE MATERIALS; ELECTRIC LOSSES; ELECTRON DEVICE TESTING; ENCAPSULATION; FLIP CHIP DEVICES; MATHEMATICAL MODELS; POLYMERS; PRINTING; RELIABILITY; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTING SILICON; WAVEGUIDES;

BUMPING; CONDUCTIVE POLYMER BUMP INTERCONNECTS; CONDUCTIVE POLYMER BUMPS; CONDUCTIVE POLYMERS; MICROWAVE INSERTION LOSS; STENCIL PRINTING;

ELECTRONICS PACKAGING;

EID: 0029721519     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (12)