A new flip chip packaging technology for the mid-range application space

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 100-104

  Pendse, Rajendra D ^a   Kim, Kyung Moon ^a   Tam, Samuel ^a  

^a ChipPAC Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BONDING; FLIP CHIP DEVICES; INTEGRATED CIRCUIT LAYOUT; SUBSTRATES;

NON-CONDUCTIVE ADHESIVES (NCA);

CHIP SCALE PACKAGES;

EID: 0036287483     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008080     Document Type: Article

References (5)

1. Reliability study of flip chip on FR4 interconnections with ACA
2. Overview of conductive ashesives interconnection technologies for LCD’s
3. Ball bumping and coining operations for TAB and flip chip
4. The viability of anisotropic conductive film as a flip chip interconnection technology