Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Materials Science and Engineering: A

Volumn 394, Issue 1-2, 2005, Pages 20-27

  Andersson, Cristina ^a   Lai, Z ^a   Liu, J ^b   Jiang, H ^c   Yu, Y ^c  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b SWEREA IVF   (Sweden)

^c UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Bulk; Electronics; Fatigue; Lead free; Low cycle fatigue; Solder joints

Indexed keywords

CRACKS; DUCTILITY; EUTECTICS; ISOTHERMS; LEAD; SOLDERING ALLOYS; STRAIN MEASUREMENT; TEMPERATURE DISTRIBUTION;

BULK SOLDERS; FATIGUE PROPERTIES; MECHANICAL FATIGUE TESTING; ROOM TEMPERATURE (RT);

SOLDERED JOINTS;

SOLDER;

EID: 17844394424     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2004.10.043     Document Type: Article

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