Surface mount conductive adhesives with superior impact resistance

Proceedings - 4th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn 1998-March, Issue , 1998, Pages 261-267

  Vona, Samuel A ^a   Tong, Quinn K ^a   Kuder, Richard ^b   Shenfield, David ^b  

^a NATIONAL STARCH AND CHEMICAL COMPANY   (United States)

^b Ablestik Laboratories   (United States)

Author keywords

conductive adhesives; drop test; impact resistance; surface mount

Indexed keywords

ADHESIVES; DROPS; ENERGY DISSIPATION; IMPACT RESISTANCE; INTERFACES (MATERIALS); SURFACE MOUNT TECHNOLOGY; SURFACE RESISTANCE; TEMPERATURE; CONDUCTIVE MATERIALS; ELASTIC MODULI;

ADHESIVE INTERCONNECTION; CONDUCTIVE ADHESIVE; CONVENTIONAL METALS; DROP TEST; ELECTRONIC APPLICATION; FINE-PITCH CAPABILITY; LOW TEMPERATURE PROCESSING; PERFORMANCE REQUIREMENTS;

PACKAGING MATERIALS; ADHESIVES;

DROP TEST; LOSS FACTOR; SURFACE MOUNT CONDUCTIVE ADHESIVES;

EID: 0032230580     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1998.664467     Document Type: Conference Paper

References (8)

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