A novel approach to stabilize contact resistance of electrically conductive adhesives on lead-free alloy surfaces

Journal of Electronic Materials

Volumn 33, Issue 2, 2004, Pages 106-113

  Li, Haiying ^a   Moon, Kyoung Sik ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Corrosion; Electrical conductive adhesive; Electrochemistry; Electronics packaging; Epoxy resin; Galvanic corrosion; Resistance stability; Sacrificial anode; Sacrificial metal; Silver filler

Indexed keywords

ALLOYS; CORROSION; DISSIMILAR METALS; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; ELECTROCHEMISTRY; ELECTRONICS PACKAGING; EPOXY RESINS; FILLERS;

ELECTRIC CONDUCTIVE ADHESIVES; GALVANIC CORROSION; SILVER FILLER;

ADHESIVES;

EID: 1542276523     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0278-4     Document Type: Article

References (8)

1. K. Gilleo, in Conductive Adhesives for Electronics Packaging, ed. J. Liu (Isle of Man, British Isles: Electrochemical Publications, 1999), p. 3.
2. J. E. Morris, in Conductive Adhesives for Electronics Packaging, ed. J. Liu (Isle of Man, British Isles: Electrochemical Publications, 1999), p. 74.
3. M. Zwolinski et al. IEEE Transactions on Components, Packaging, and Manufacturing Technology 19, 241 (1996).
4. D. Lu, C.P. Wong, and Q.K. Tong, IEEE Trans-CPMT-C 22, 3 (1999), pp. 228-232.
5. D. Lu, C.P. Wong, and Q.K. Tong, IEEE Trans-CPMT-C 22, 3 (1999), pp. 223-227.
6. D.A. Jones, Principles and Prevention of Corrosion, 2nd ed., (Upper Saddle River, NJ: Prentice Hall, 1996).
7. H. Takezawa, T. Mitani, T. Kitae, H. Sogo, S. Kobayashi, and Y. Bessho, 2002 8th Int. Advanced Packaging Materials Symp. (New York: IEEE, 2002) pp. 139-143.
8. C.P. Wong, H. Li, and K. Moon, U.S. patent (pending).